JPH0528764Y2 - - Google Patents

Info

Publication number
JPH0528764Y2
JPH0528764Y2 JP1987144174U JP14417487U JPH0528764Y2 JP H0528764 Y2 JPH0528764 Y2 JP H0528764Y2 JP 1987144174 U JP1987144174 U JP 1987144174U JP 14417487 U JP14417487 U JP 14417487U JP H0528764 Y2 JPH0528764 Y2 JP H0528764Y2
Authority
JP
Japan
Prior art keywords
capillary
bonding
bonding position
coordinates
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987144174U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6448030U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987144174U priority Critical patent/JPH0528764Y2/ja
Publication of JPS6448030U publication Critical patent/JPS6448030U/ja
Application granted granted Critical
Publication of JPH0528764Y2 publication Critical patent/JPH0528764Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1987144174U 1987-09-21 1987-09-21 Expired - Lifetime JPH0528764Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987144174U JPH0528764Y2 (en]) 1987-09-21 1987-09-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987144174U JPH0528764Y2 (en]) 1987-09-21 1987-09-21

Publications (2)

Publication Number Publication Date
JPS6448030U JPS6448030U (en]) 1989-03-24
JPH0528764Y2 true JPH0528764Y2 (en]) 1993-07-23

Family

ID=31411643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987144174U Expired - Lifetime JPH0528764Y2 (en]) 1987-09-21 1987-09-21

Country Status (1)

Country Link
JP (1) JPH0528764Y2 (en])

Also Published As

Publication number Publication date
JPS6448030U (en]) 1989-03-24

Similar Documents

Publication Publication Date Title
JPH0528764Y2 (en])
JP2598192B2 (ja) 半導体製造装置
JP2534132B2 (ja) ボンデイング方法
DK1233845T3 (da) Fremgangsmåde og anordning til positionering af en svejsebrænder midt i et ønsket svejsesømforløb
WO1989001381A1 (en) Weaving welding with welding robot
EP0354969A1 (en) Weaving welding method
JPS63206806A (ja) Ｎｃ制御装置の先行精度補償方法
JP2643937B2 (ja) 超音波ウエツジボンダ
JPS631032A (ja) パタ−ン形成方法
JPS6111815A (ja) ロボツトの位置ズレ補正システム
JP2625956B2 (ja) ワイヤボンディング装置
JPH0315819B2 (en])
JPH0377337A (ja) ワイヤボンデイング装置および半導体装置の製造方法
JP2655898B2 (ja) 記憶・再生型アーク溶接ロボットの制御方法
JPS62279086A (ja) 重ね溶接における開先倣い方法
JPH0722830B2 (ja) 自動溶接機におけるトーチの位置制御方法
JPS61290304A (ja) 基板穴位置測定装置
JPH0810187Y2 (ja) ダイボンディング装置
KR100353967B1 (ko) 비젼시스템을이용한용접선추적방법
JPS632568A (ja) 重ね溶接における開先倣い方法
JP2739181B2 (ja) ワーク設定位置補正装置
JPS6232513A (ja) 無人車両の旋回制御方法
JPH1050760A (ja) ボンディング方法およびボンディング装置
JPS60118383A (ja) 溶接線倣い方法
JPH04353903A (ja) 倣いセンサロボットシステム